AI MECHATEC AI MECHATEC

Process Development CenterProcess Development Center

Process Development Center

We have lined up process equipment, enlarged clean environment, and various verification and measurement equipment to create new value. We will proactively conduct consortium activities with research and development agencies including materials.
we are challenging the innovation of the manufacturing process,
in order to provide optimal solutions for customers.

Thin Film Formation Technology

Inkjet Equipment

  • Possible to deposit nano-level thin films of trace amounts of functional materials
  • Possible to select inkjet heads according to customer's purpose
Inkjet Equipment
Various Type of Inkjet Head
No. Items Specifications
1 Applicable Substrate Max. 400x500mm
2 Mounted IJ Head Various such as1/3.5/10/14pl
3 Temp. Control Unit Head Isothermal Max. 50 degree C
4 Coating Resolution Min. 1um
5 Coating Speed Max. 200mm/s
6 LED-UV Wavelength 365nm
7 Applicable material Various (Please consult)

Vacuum Drying Oven

Vacuum Drying Oven
Vacuum Drying Oven
No. Items Specification
1 Applicable Substrate Max. 400 x 500mm
2 Vacuum Exhaust Dry Pump, Turbomolecular Pump
3 Exhaust Speed DP: 30,000L/min.
TMP: 1,300L/min.
4 Exhaust Speed Control Possible to set
5 Heating Table Max. 250 degree C
6 Ultimate Vacuum 0.1 Pa and less

Heated Drying Oven

  • Possible to heat and dry coated substrate at the set temperature.
Heated Drying Oven
Heated Drying Oven
No. Items Specification
1 Applicable Substrate Max. 400 x 500mm
2 Heated Oven Slot Number 2 slots
3 Heated Table Max. 250 degree C
4 Substrate Heating Height Possible to set (0 – 5mm)

Nanoimprint Technology

Nanoimprint Equipment

  • Possible to make soft mold from master mold to film
  • Void less imprint is possible by imprint roll and soft mold
Nanoimprint Equipment
Nanoimprint Equipment
No. Items Specification
1 Applicable Substrate Max. 300 x 400mm
2 Applicable Film Width Max. 300mm
3 Imprint Pressurization Max. 1,000N Roll Pressurization
4 Imprint Speed 0.1 – 100mm/s
5 Demolding Speed 0.1 – 100mm/s
6 LED-UV 365nm Scan Radiation Type
7 Material Coating IJP Demo Equipment is applied

Inkjet Equipment

  • Possible to deposit nano-level thin films of trace amounts of functional materials
  • Possible to select inkjet heads according to customer's purpose
Inkjet Equipment
Inkjet Equipment
No. Items Specifications
1 Applicable Substrate Max. 400x500mm
2 Mounted IJ Head Various such as1/3.5/10/14pl
3 Temp. Control Unit Head Isothermal Max. 50 degree C
4 Coating Resolution Min. 1um
5 Coating Speed Max. 200mm/s
6 LED-UV Wavelength 365nm
7 Applicable material Various (Please consult)

Spatter Film Forming Equipment

  • Possible to form metal films such as AL or Cr with nano-level
Spatter Film Forming Equipment
Spatter Film Forming Equipment
No. Items Specification
1 Equipment Model SH-450-T10
2 Applicable Substrate Max. dia. 8 inch (200mm)
3 Power Source 2kW High Frequency Power Source x 1 set
Possible to form insulation material and Metal target
4 Reversed Spatter Mechanism Yes
5 Spatter Cathode Diameter 6 inch Nonmagnetic Cathode x 3 sets
6 Process Gas Ar、N2
7 Ultimate Pressure 1.0 x 10-4 Pa and less

ICP Etching Equipment

  • Possible to etch for Sub-micron pattern.
  • Possible to etch and ash in the same chamber.
ICP Etching Equipment
Example of Si Etching by ICP Etching Equipment
No. Items Specification
1 Equipment Model SERIO-2A-LHOF
2 Applicable Substrate Max. dia. 8 inch (200mm)
3 Power Source 2kW High Frequency Power Source x 1 set
500W Low Frequency Power Source x 1 set
4 Work Fix Method Static chucking method (with cooling mechanism)
5 Taper Angle Control 90 to 85 degree
6 Process Gas Max. 5 systems (CL, F system gas)
7 Ultimate Pressure < 1.3 x 10-3 Pa (ICP processing room)

Spin Coat Coating Equipment

  • Possible to form uniform rotating coat formation of chemicals such as photo resist on film forming substrate.
Spin Coat Coating Equipment
Spin Coat Coating Equipment
No. Items Specification
1 Equipment Model K-359SD-2
2 Applicable Substrate Max. dia. 8 inch (200mm)
3 Film Forming Thickness 10nm – several nm
4 Rotation Number Max. 7,000 rpm
5 Rotation Accuracy +/- 0.2% (~3,000rpm)
6 Work Fix Method Vacuum Suction
7 Material Coating Drip Volume is controlled by DSP Demo Tool

Coating & Assembling Technology

High Precision Coating Equipment

  • LCD Process: Applicable for Seal / LC Material Coating
    OLED Process: Applicable for DAM / FILL Material Coating
  • To confirm Optimal Coating Conditions for each material by Various DSP Head & IJP Head.
High Precision Coating Equipment
High Precision Coating Equipment
No. Items Specification
1 Applicable Substrate □400 – 900 mm square
2 Seal / DAM Coating Pneumatic Dispenser
3 Seal / DAM Viscosity 10,000 – 1,000,000mP・s
4 LC / FILL Coating 1 Micro Syringe
5 LC / FILL Viscosity 10 – 500mPa・s
6 LC / FILL Coating 2 Inkjet
7 LC / FILL Viscosity 5 – 15mPa・s

Vacuum Assembling System Equipment

  • Possible to assemble LCD Panel by ODF process method in high degree of vacuum
Vacuum Assembling System Equipment
Vacuum Assembling System Equipment
No. Items Specification
1 Substrate Size Max. 400 x 500mm
2 Vacuum Chuck D-PSC Adhesive Pad
3 Ultimate Vacuum Degree 0.5Pa
4 Pressurized Force Max. 5.0KN

Heated Drying Oven

  • Possible to heat and dry coated substrate at the set temperature.
Heated Drying Oven
Heated Drying Oven
No. Items Specification
1 Applicable Substrate Max. 400 x 500mm
2 Heated Oven Slot Number 2 slots
3 Heated Table Max. 250 degree C
4 Substrate Heating Height Possible to set (0 – 5mm)

Semiconductor Package Technology

Vacuum / Atmospheric Laminator

  • Laminating Films on both side of board by Roll to Roll Method Transport
  • Possible to laminate with Micro Void-less, and Void-less laminating at uneven portions
Vacuum / Atmospheric Laminator
Vacuum / Atmospheric Laminator
No. Items Specification
1 Applicable Substrate Width Max. 350mm
2 Applicable Film Width Max. 330mm
3 Lamination Roll Induction Heating Jacket Roll
4 Lamination Speed 0.1 ~ 4.0 m/min.
5 Lamination Line Pressure Max. 7 N/cm
6 Lamination Temperature R.T. ~150 degree C +/- 3 degree C
7 Ultimate Vacuum Degree 50Pa

Microball Printing / Mounting System

  • Possible to print High Accuracy Flux and Microball.
Microball Printing / Mounting System
Microball Printing / Mounting System
No. Items Specification
Substrate Wafer
1 Applicable Substrate / Wafer Size Max. 300 x 300mm 6/8/12 inch
2 Substrate / Wafer Thickness 0.15 – 2.0 mm 0.2 - 0.8mm
3 Ball Diameter 40 - 300um 50 - 300um
4 Ball Pitch 85um - 110um -

Others

UV Curing Oven

  • Curing Material by UV Radiation
UV Curing Oven
No. items specifications
1 Applicable Substrate 730×900mm
2 Method Metal Halide
3 Wave Length 330 - 450nm
4 Illumination 100mW/cm2

Ultrasonic Cleaning

  • Cleaning by Ultrasonic
Ultrasonic Cleaning
No. Items Specification
1 Applicable Substrate 370×470mm
2 Cleaning Tank 2 Tank Type
3 Cleaning Possible to shake and control temperature
4 Cleaning Solvent Pure Water / Diluted Cleaning Solvent
5 Drying Using equipped Hot Stove

Surface
Reforming
Equipment

  • Excimer UV Method
  • Reforming Size:
    Max. □1,000㎜ Square
Surface Reforming Equipment

Film Thickness Step Measuring Device

  • Contact Method by Measurement Needle
  • Measurement Size: Max. 210mm Squire
膜厚段差計測器

Shape Analysis Laser Microscope

  • Violet semiconductor laser: 404 nm (class 2) non-contact type
  • Measurement size: Max □ 300 mm square
Shape Analysis Laser Microscope