Process Development CenterProcess Development Center

Process Development Center

  1. 2020/06/23 Start Demo of VAS for Multi-size substrate
  2. 2020/06/23 Start Ink-Jet Printing Demo in Nitrogen atmosphere　

We have lined up process equipment, enlarged clean environment, and various verification and measurement equipment to create new value. We will proactively conduct consortium activities with research and development agencies including materials.
we are challenging the innovation of the manufacturing process,
in order to provide optimal solutions for customers.

Inkjet Technology

RGB-IJP Equipment

RGB-IJP Equipment

  • Fine Dot Printing, 300ppi　RGB Printing
RGB-IJP Equipment
No. Items Specifications
1 Substrate size Max　400×500mm
2 Method Piezo Inkjet
3 Materials UV cure resin
Conductivity resin
Resin with solid content
Material with QD
4 Volume（pl) 2～4
5 Environment Air・N2
TFE-IJP Equipment

TFE-IJP Equipment

  • Surface Printing: Thickness 1～200μm
TFE-IJP Equipment
No. Items Specifications
1 Substrate size Max　370×470mm
2 Method Piezo Inkjet
3 Materials UV cure resin
Conductivity resin
Liquid crystal
4 Volume（pl) 6～40
5 Environment Air・N2
IJ / Jet Printing Equipment

IJ / Jet Printing Equipment

  • Evaluate High viscosity materials by IJP and Jet Dispenser
IJ / Jet Printing Equipment
No. Items Specifications
1 Substrate size Max　370×470mm
２(1) Method Piezo Inkjet
Volume（pl) 2～40
Viscosity(mPa.s) 10～500(heated)
2(2) Method Jet
Volume（µl) 0.001～0.2
Viscosity(mPa.s) 100～100,000
Vacuum Dryer

Vacuum Dryer

  • The vacuum dryer that can be set vacuum profile and temperature
Vacuum Dryer
No. Items Specifications
1 Substrate size Max　400×500mm
2 Evacuation DP, TMP
3 Evacuate speed DP：30,000L/min
TMP:1,300L/min
4 Evacuate control Configurable
5 Heat table Max 250℃
6 Degree of vacuum Below 0.1Ｐａ
Bake Oven

Bake Oven

  • Bake oven that can be set temperature
Bake Oven
No. Items Specifications
1 Substrate size Max　400×500mm
2 Slot ２ slot
3 Heat table Max 250℃
4 Substrate position (height) Configurable （0～5mm）
Offline Equipment

Offline Equipment

  • Evaluate for stable volume jetting of material
Offline Equipment
No. Items Specifications
1 Method Piezo Inkjet
2 Materials UV cure resin
Conductivity resin
Liquid crystal
3 Volume（pl) 6～40
4 Environment Air

Dispense・Alignment Technology (ODF)

Dispenser

Dispenser

  • LCD：Seal/LC dispensing　　
    OLED：DAM/FILL dispensing
  • Optimize for each materials by various of DSP head and Inkjet head
Dispenser
No. Items Specifications
1 Seal/DAM dispense Pneumatic Dispenser
2 Seal/DAM viscosity 10,000～1,000,000mP・s
3 LC/FILL dispense 1 Micro Syringe
4 LC/FILL viscosity 10～500mPa・s
5 LC/FILL dispense 2 Inkjet
6 LC/FILL viscosity 5～15mPa・s
Inkjet Equipment

Inkjet Equipment

  • Capable of forming nano-level thin films of functional materials
  • Inkjet head can be selected according to the customer's purpose
Inkjet Equipment
No. Items Specifications
1 Substrate size Max　400×500mm
2 IJP head 1/3.5/10/14pl etc.
3 Heat unit Heat Max 50℃
4 Resolution Minimum　1μm
5 Speed Max　200mm/s
6 LED-UV 365nm
7 Materials Various （Please ask）
Vacuum Alignment System

Vacuum Alignment System

  • Bonding by ODF method under high vacuum is possible even for large substrates
  • Multi-size support is now possible
Vacuum Alignment System
No. Items Specifications
1 Substrate size Mas 925×1500mm
2 Chuck method D-PSC　Adhesive Pad
3 Degree of vacuum 0.5Pa
4 Mechamical press Max　5.0KN

Semiconductor Package Technology

Micro ball Mount System

  • Applicable for PCB/Wafer　Apply 40um ball mounting
  • Realize high throughput by systemize inspection and repair equipment
Micro ball Mount System
No. Items Specifications
1 Substrate PCB/Wafer
2 Substrate size Max 300ｘ300mm*1
3 Substrate thickness 0.10㎜～
4 Ball size 40μｍ～
5 Ball pitch 85μｍ～
6 Line tact 60 sec （depends on conditions）
7 Accuracy ±10um
8 Inspection & Repair
Camera resolution 		4.5um Pixel
9 Inspection & Repair
Repair nozzle 		2 or 4 nozzle
*1 Please ask over 300x300mm size
Vacuum/Air Laminator

Vacuum/Air Laminator

  • Laminate film on both sides of substrate by roll-to-roll method
  • Vacuum bonding can be selected and micro voidless or stepped voidless bonding is possible
Vacuum/Air Laminator
No. Items Specifications
1 Base size Max　350mm
2 Film width Max　330mm
3 Lamination roll Jacket roll with induction heat
4 Speed 0.1～4.0m/min
5 Pressure Max　7N/cm
6 Temperature R.T.～150℃±3℃
7 Degree of vacuum 50Pa

Thin Film Forming Technology

Nanoimprint Equipment

Nanoimprint Equipment

  • Film soft mold can be formed from master mold
  • Voidless imprint is possible with imprint roll and soft mold
Nanoimprint Equipment
No. Items Specifications
1 Substrate size Max　300×400mm
2 Film width Max　300mm
3 Imprint pressure Max　1000N
4 Imprint speed 0.1～100mm/s
5 Demolding speed 0.1～100mm/s
6 LED-UV 365nm Scan type
7 Materia coating IJP demo equipment
Spin Coating Equipment

Spin Coating Equipment

  • Efficient and uniform spin coating of chemicals such as photoresist on the substrate
Spin Coating Equipment
No. Items Specifications
1 Model number K-３５９SD-２
2 Substrate size Max φ８ inch （200mm）
3 Forming thickness １0nm～several um
4 Rotation Max 7,000rpm
5 Rotation accuracy ±0.2％（～3,000rpm）
6 Fix method Vacuum suction
7 Materials Drop by Demo equipment
Spatter Equipment

Spatter Equipment

  • Capable of forming metal films such as AL and Cr at the nano level
Spatter Equipment
No. Items Specifications
1 Model number SH-450-T10
2 Substrate size Max φ８ inch （200mm）
3 Power source 2kW High Frequency Power Source x 1 set
Possible to form insulation material and Metal target
4 Reversed spatter Yes
5 Spatter cathode φ6 inch Nonmagnetic Cathode x 3 sets
6 Process gas Ar、N2
7 Degree of vacuum Below 1.0×10-4Pa
ICP Etching Equipment

ICP Etching Equipment

  • Possible to etch for Sub-micron pattern
  • Possible to etch and ash in the same chamber
ICP Etching EquipmentによるSiエッチング例
No. Items Specifications
1 Model number SERIO-2A-LHOF
2 Substrate size Max φ８ inch （200mm）
3 Power 2kW High Frequency Power Source x 1 set
500W Low Frequency Power Source x 1 set
4 Work fix method Static chucking method (with cooling mechanism)
5 Taper angle cotrol 90°～85°
6 Process gas Max ５ system （CL・F gas）
7 Degree of vacuum ＜1.3×10-3Pa（ICP room）

Measuring Equipment and Others

Surface Reforming Equipment

Surface Reforming Equipment

  • Excimer UV method
  • Substrate size：
    Max □1000mm
Film Thickness Step Measuring Device

Film Thickness Step Measuring Device

  • Contact method by needle
  • Substrate size：
    Max □210mm
Shape Analysis Laser Microscope

Shape Analysis Laser Microscope

  • Violet semiconductor laser: 404nm (class 2) non-contact type
  • Substrate size：Max □300mm
ＵＶ Curing Oven

ＵＶ Curing Oven

  • Curing material by UV radiation
No. Items Specifications
1 Size 730×900mm
2 Method Metal Halide
3 Wave Length 330～450nm
4 Illumination 100mW/cm2
Ultrasonic Cleaner

Ultrasonic Cleaner

  • Max□370×470mm size is applied
No. Items Specifications
1 Tank 2 tank
2 Cleaning Shake and Temp control
3 Solvent Pure water/Cleaning solvent
4 Drying Hot air
Large size Bake Oven

Large size Bake Oven

  • Max□1,500×900mm（G6-Half） glass is applied
  • Large size oven that can handle various heat treatment such as Dry, Baking and Annealing
No. Items Specifications
1 Model number HLKS-4C
2 Substrate size Max 1,500×900 mm
（3 slots）
3 Method Air circulation
4 Heat temperature Max 300 ℃
5 Environment Air