New Products

Linear AMC Module Production System ＊AMC： Automated Material Connect

  • Propose Coating Process for various Resin Materials such as Optical Bonding Materials as One-stop Solution.
  • Realized Lower Cost Process by optimizing Module Production Process with Circulation Linear Transport System.
  • Enabled to link with applications such as High-Precision Coating Mechanism like Ink-Jet Printer, Dispenser, etc.
    in accordance with the production sites. System Upgrading with Laminator / Assembling Mechanism is possible.
  • Applications: Module Process for Information Terminals such as Smartphone and Tablet, Information Display Devices such as In-Vehicle Center Information Display, and Various Coating and Assembling Process
Linear AMC Module Production System
Basic Specifications
No. Items Specifications
1 Work Size 340mm×250mm
2 Work Materials Alkali-free Glass / Glass Epoxy
Please inquire for details.
3 Applicable Materials Optical Bonding Materials, etc.
Please inquire for details.
4 Line Cycle Time 12sec. & over
Varied depending on System Configuration
5 System Upgrading Refer to System Upgrading Mechanism at the right column.
6 System Size W8,200 x D3,200 x H2,400mm
Varied depending on System Configuration
System Upgrading Mechanism

Solder Ball Mounter for Wafer

  • Realized Higher Yield by applying Ball Mounting Technology for Semiconductor Package Substrate to Wafer
  • Enabled High Quality & Stable Production by Special Flux Printing Technology
  • Improved Productivity by New Squeegee Head
  • Compact Design
  • Applicable for SECS/GEM, OHT & AGV (Option)

Features

  • Flux Printing
    ・Reduced Flux Bleeding by Gap Printing
    ・Stabled Transfer Position by One-direction Printing Mechanism
    ・Minimized Cleaning Frequency
  • Ball Mounting
    ・New Infinity Head (Triple Type Rotary & Closed Type Squeegee)
    ・Higher Throughput
    ・Minimized Sweeping Frequency
    (1/3 compared with the conventional type)
    ・ Increased Solder Ball Use Efficiency
    (1/2 compared with the conventional type)
    ・Magnet Adsorption & Snap-Off Mechanism

Application

  • Wafer such as WLCSP, FOWLP, etc.

Inspection & Repair

  • Enabled to systematize Ball Mounting System with Inspection & Repair Equipment
Specifications
No. Items Specifications
ABM-04G-WFS ABM-04S-WFS
1 Wafer Size Φ300mm
Φ200mm		 Φ300mm
Φ200mm
2 Handling System Load port
（FOUP or FOSB)		 Load port
（FOUP or FOSB)
3 Applicable Ball Size 40um～300um 80um～300um
4 Alignment Accuracy ＜±10um ＜±15um
5 Flux Printing Gap Printing
(Single Direction) 		Gap Printing
(Single Direction)
6 Ball Mounting Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee) Adopted New Infinity Head (Triple Type Rotary & Closed Type Squeegee)
7 Ball Missing Rate ＜20ppm
(as per AIM’s test conditions)		 ＜30ppm
(as per AIM’s test conditions)
8 Throughput 65UPH
(as per AIM’s test conditions) 		40UPH
(as per AIM’s test conditions)
9 Equipment Size 3995(W)ｘ2150(D)ｘ2020(H)mm 3555(W)ｘ2150(D)ｘ2020(H)mm
10 Equipment Weight Approx. 3,500kg Approx. 3,300kg

Φ30um Solder Ball Mounting System (Patented)

  • Realized Uniform Flux Coating enabling Ultra Fine Pitch by Inkjet Technology.
  • Contributed to Stable Ball Mounting and Productivity Improvement by High-Speed Rotary Head.
  • Enabled High-Speed Inspection and Repair by “On the Fly Inspection” as Non-Stop Continuous Inspection.
  • Total Solution contributing to Yield and Productivity Improvement for Microscopic Solder Ball Mounting Process with Ultra Fine Pitch.

Features

  • Flux Coating
    Inkjet Coating without using conventional Stencil Mask
  • Ball Mounting
    New Rotary Head to provide High Throughput
  • Inspection & Repair
    Continuous High-Speed Inspection (On the Fly)
    Capable for □120mm Unit size Inspection & Repair
  • Not required Stencil mask for Flux printing process and Flux Usage to be improved

Application

  • Package Substrate
    (FCCSP, FCBGA, MCP/MPU, 2.5/3D, FOPLP, etc.)
  • Wafer (WLCSP, FOWLP, etc.)
Specifications
No. Items Specifications
1 Work Size Substrate: Max. 340L×250W (mm)
Wafer: Max.12“ (φ300mm)
2 Work Type Substrate Wafer for Package like Substrate Epoxy Glass, etc.
3 Applied Ball Diameter 30um - 300um
4 Flux Coating Equipment Inkjet Coating
5 Solder Ball Mounting Equipment High-Speed Ball Mounting,
No Ball: 30ppm (AIM’s conditions)
6 Inspection Method On the Fly Inspection
Max. Unit Size □120mm
7 Throughput 65UPH (AIM’s conditions)

Plasma Laser Repair Equipment ALR-04G-P4 (PAT. PEND.)

  • Plasma Laser Repair Equipment for Semiconductor Packages enabling Yield Improvement
  • Enabled Inspection and Repair for Solder Ball Drop Defects during Reflow and De-Flux Cleaning Process after Ball Mounting
  • Realized Spot Reflow soldering (local soldering for only repairing points) by integrating Plasma and Laser Technologies
  • Minimized Reflow Process impacting qualities of Semiconductor Packages

Features

  • Realized Inspection & Repair for Ball Drop Defects during Reflow and Cleaning Process
  • High Speed Overall Surface Inspection for Work(Substrate and Wafer)
  • Flux dipping & High Precision Solder Ball Mounting
  • Soldering by Plasma & Laser technologies
  • Proposal for Off-Line or In-Line System

Application

  • Package Substrate & Unit Substrate after Dividing
    (FCCSP, FCBGA, MCP/MPU, 2.5/3D, FOPLP, etc.)
  • Wafer (WLCSP, FOWLP, etc.)
Basic Specifications
No. Items Specifications
1 Work Size Substrate: Max. 340L×250W (mm)
Wafer: Max.12“ (φ300mm)
2 Work Type Substrate (Epoxy Glass, etc.)
Wafer
3 Applied Ball Diameter 40um - 300um
4 Inspection Method On the Fly Inspection
5 Solder Ball soldering Method Plasma + Laser
6 Cycle Time (Repair + Solder Ball soldering) 50 sec. (based on our conditions for evaluation)
7 Equipment Dimensions W2,600 x D2,400 x H2,150mm
(excl. Handling & Projected Portion)
8 Equipment Weight 3,000 kg

Nano-level High Precision Vacuum Assembling System (NPV-300)）

  • High Precision Vacuum Assembling System enabling Nano-level Assembling Precision
  • Improved Device Performance by integrating with Ink-jet Microscopic High Precision Coating Technology
  • Propose One Stop Solution by which contribute to improve Manufacturing Process and Production Efficiency

Features

  • Higher Precision was realized by newly developed Nano-level Alignment Mechanism
  • Improved Resolution by Higher Resolution Camera
  • External Micro-vibration Control by Vibration Isolation Control System (Option)

Application

  • Micro Display (Micro LED, Si-OLED XR (AR/VR/MR), LCOS, HTPS)
  • Optical Device (CMOS, Various Sensors)
  • Sensing Device (LiDAR)
No. Items Specifications
1 Work Size 8”(φ200mm)
12“(φ300mm)
2 Work Materials Alkali-free Glass / Si
3 Work Holding Method D-PSC / LVC Method
4 Assembling Accuracy ≦100nm
5 Assembling Load 0.5KN（Max）
6 Vacuum Degree ＜ 10-1Pa
7 Equipment Size W2,800 × D2.400 × H2,900mm
8 Equipment Weight 7,000kg

RGB Ink-Jet Printing System

  • Capable for forming materials of OLED, QDOLED and QDμLED, etc.
  • Supplied many process equipment and control system for large panels’ field
  • Turnkey solution (Ink-jet Printing, Dry, Bake, Environment)
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Use optimum nozzles for materials characteristics

  • Material circulation mechanism for QD forming materials and accurate temperature control
  • Optimize wave form by intelligent ink-jet head and controller

Mass-production technology standard equipped

  • Matrix offset and injecting pitch (liquid-droplets’ pitch) offset
  • High speed inspection for all Nozzles injection and dripped volume & position
  • Minimize idle time by simultaneous calibration mechanism and structure

Optimize vacuum dry process

  • Optimum design and construction by vacuum control technology and numerical analysis
  • Liquid analysis, VCD vacuum dry, Liquid-droplets behavior simulation

Applicable for various pixel design

  • Pen tile, Side by side and Line bank

Solder Ball Mounter

  • Ensure and deliver mass-production by 40um solder ball
  • New rotary head provides high throughput (25% improved vs Conventional head)
  • On the fly inspection is capable for large packages without any limitation.
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Items Specifications
Line Configuration Flux / Ball printer / Inspection & Repair
Panel Transportation Pick & Place　(Vacuum pad) or Pick & Place　(Clamp)
Throughput（Tact Time） 65sec
Applicable panel size Max. 420 x 300 - Min. 200L x 75W(mm)
Applicable ball diameter 40 - 500(μｍ)
Alignment repeatability < ±10um
Missing rate (No ball ratio) < 20ppm
Inspection method On the fly inspection (Non-stop imaging)
Applicable max. unit size 120.0 × 120.0(mm)
Inspection time (Reference) Approx 16sec./ 1/4 panel(144unit/panel)
Repair With Flux W/O Flux Available
Ball remove (for extra ball) Available

Micro Display Production System

  • Turnkey ODF solution for 200mm and 300mm Wafer
  • Deliver high performed gap control and ensure high productivity
  • Contributing to various micro display production now (OLED,LCOS,HTPS)
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Turnkey Solution

  • High yield
  • Quick set-up & Sable mass-production
  • Process supports by own know-how

All in One System

  • DAM drawing Dispenser
    High speed & Fine line drawing (600um
  • FILL coating Ink-Jet
    Capable for High viscosity material (～1000mPa/s)
  • VAS (Vacuum Assembling System)
    High accurate assembling (Accuracy: 3σ≦0.2um)

Smart Production System

  • Capable system for factory automated production & Remote supports system
  • Integrated control for process equipment and material supply system
  • Provide a solution for clean environment and products
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System integrated Control & Management

  • Remote
  • Optimal process
  • Energy saving
  • Maintenance & Service

Automation 1
(for Process Equipment)

  • Material supply
  • Set-up for products changeover

Automation 2
(for Transport System & Unit)

  • Transport system
  • Set-up for materials preparation
  • Set Up for materials preparation (Example)
  • Transport system(Example)
  • Set Up for production changeover(Example)