Linear AMC Module Production System ＊AMC： Automated Material Connect
- Propose Coating Process for various Resin Materials such as Optical Bonding Materials as One-stop Solution.
- Realized Lower Cost Process by optimizing Module Production Process with Circulation Linear Transport System.
Enabled to link with applications such as High-Precision Coating Mechanism like Ink-Jet Printer, Dispenser, etc.
in accordance with the production sites. System Upgrading with Laminator / Assembling Mechanism is possible.
- Applications: Module Process for Information Terminals such as Smartphone and Tablet, Information Display Devices such as In-Vehicle Center Information Display, and Various Coating and Assembling Process
Solder Ball Mounter for Wafer
- Realized Higher Yield by applying Ball Mounting Technology for Semiconductor Package Substrate to Wafer
- Enabled High Quality & Stable Production by Special Flux Printing Technology
- Improved Productivity by New Squeegee Head
- Compact Design
- Applicable for SECS/GEM, OHT & AGV (Option)
Φ30um Solder Ball Mounting System (Patented)
- Realized Uniform Flux Coating enabling Ultra Fine Pitch by Inkjet Technology.
- Contributed to Stable Ball Mounting and Productivity Improvement by High-Speed Rotary Head.
- Enabled High-Speed Inspection and Repair by “On the Fly Inspection” as Non-Stop Continuous Inspection.
- Total Solution contributing to Yield and Productivity Improvement for Microscopic Solder Ball Mounting Process with Ultra Fine Pitch.
Plasma Laser Repair Equipment ALR-04G-P4 (PAT. PEND.)
- Plasma Laser Repair Equipment for Semiconductor Packages enabling Yield Improvement
- Enabled Inspection and Repair for Solder Ball Drop Defects during Reflow and De-Flux Cleaning Process after Ball Mounting
- Realized Spot Reflow soldering (local soldering for only repairing points) by integrating Plasma and Laser Technologies
- Minimized Reflow Process impacting qualities of Semiconductor Packages
Nano-level High Precision Vacuum Assembling System (NPV-300)）
- High Precision Vacuum Assembling System enabling Nano-level Assembling Precision
- Improved Device Performance by integrating with Ink-jet Microscopic High Precision Coating Technology
- Propose One Stop Solution by which contribute to improve Manufacturing Process and Production Efficiency
RGB Ink-Jet Printing System
- Capable for forming materials of OLED, QDOLED and QDμLED, etc.
- Supplied many process equipment and control system for large panels’ field
- Turnkey solution (Ink-jet Printing, Dry, Bake, Environment)
Solder Ball Mounter
- Ensure and deliver mass-production by 40um solder ball
- New rotary head provides high throughput (25% improved vs Conventional head)
- On the fly inspection is capable for large packages without any limitation.
Micro Display Production System
- Turnkey ODF solution for 200mm and 300mm Wafer
- Deliver high performed gap control and ensure high productivity
- Contributing to various micro display production now (OLED,LCOS,HTPS)
Smart Production System
- Capable system for factory automated production & Remote supports system
- Integrated control for process equipment and material supply system
- Provide a solution for clean environment and products