Features

• Solder Ball Mounter for Φ40um Balls to meet the needs of Advanced Semiconductor Packages
• Realized High Throughput by New Rotary Squeegee (25% faster compared with conventional type)
• On-the-Fly Continuous Inspection Function applicable for Llarge-sized Semiconductor Packages for Server such as HPC

Features

• Realized High Yield by applying Ball Mounting Technologies for Semiconductor Package Substrate to Wafer.
• Enabled High Throughput and improved Solder Ball Usage Efficiency with New Inifity Head (1/2 compared with conventional type)
• Enabled to total Solution for Solder Ball Mounter System with Inspection and Repair Equipment

Features

• Realized Uniform Flux Application applicable for Narrower Pitches by applying Ink-Jet Printing (IJP) Technologies
• Contributed to improve Yield and Productivity by New Rotary Head and On-the-Fly High-Speed Inspection & Repair
• Improved Material Usage Efficiency with Maskless (No Conventional Stencil Mask is needed for Flux Printing Process) (Twice as much as Conventional Type)

Features

• Realized Inspection and Repair for Solder Ball Drop Defects during Reflow and Flux Cleaning Processes
• Realized Spot Reflow by integrating Plasma and Laser Technologies and minimized Reflow Process
• Enabled to propose In-Line System with Solder Ball Mounter