NEWS

• 2021/11/29

  Orders received for “Micro Display Encapsulation System by Wafer”

• 2021/10/25

  Sales Release of “Linear AMC Module Production System”to optimize Coating Process for Optical BondingMaterials

• 2021/10/04

  Sales Release of “Solder Ball Mounter for Wafer”having realized Higher Yield and Throughput

• 2021/09/21

  Sales Release of “Solder Ball Mounting System applicable for Φ30umBall”for Circuit Miniaturization of Semiconductor Package

• 2021/08/27

  Sales Release of “Plasma Laser Repair Equipment” for Yield Improvement in Semiconductor Packaging Process (PAT. PEND.)

• 2021/08/25

  New Products Release “Nano-level High Precision Vacuum Assembling System (NPV-300) “

• 2021/04/19

  Resolution by Settlement of the Injunctive Relief and other Petitions for Patent Infringement Case

• 2021/03/12

  AIMECHATEC, Ltd. awarded the Ichimura Prize in Industry