Process Support
(Solder Ball Mounting Process)

We will quickly respond back to your concerns and various issues regarding Solder Ball Mounting Process.For your inquiries, please fill out the following column.

Company or Organization Name
E-Mail Address
E-Mail Address(confirmation)
Telephone Number
Applicable Equipment
Serial Number
Consultation Contents (up to 400 characters)
Data Attachment
(up to 10 MB per 1 File)

* In case File cannot be attached due to large size, please use File Transfer Service and describe Download URL in "Consultation Contents".

Inquiry by e-mail

1. Personal Information Protection Policy

Personal information provided will be used for the following purposes (Personal Information Protection Policy)
・To receive the opinion and impressions of the provider
・To respond to inquiries from the provider and documents request
・To survey the market and to develop new products and services

Our company will not use the received Personal Information for the purpose other than the above without prior consent of the provider.

2.Remarks on Inquiry Form

For inquiries by e-mail to us, please fill in the inquiry form.
There may be cases where our company cannot answer in case the answer is not properly filled out, or depending on the inquired contents. Depending on the inquired contents, it may take longer time to respond depending on the inquired contents. Since answers shall be sent to individual customers, secondary use such as reprint, transfer, etc. is strictly prohibited.